Source: Maximum-TechSurprisingly, Intel has admitted that their latest Ivy Bridge platform runs hotter and its because of the increased thermal density which is the result of 22nm manufacturing node. Intel said, “users may observe higher operating temperatures when overclocking”. They further added, “This is as designed and meets quality and reliability expectations for parts operating under specified conditions.”
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wtf this means fail tech , things should run cooler and faster as size decreases
Im Better at Everything
That's a wrong perception.Originally Posted by cobby
Die shrinks from 32 nm -> 22nm.
Chain effects:
Little lower production of heat -->> Much more slower dissipation of heat. Therefore, it stays hotter despite a lower amount of heat produced because the heat cannot be dissipated as efficiently.
^^^^^^^^^^^^^^^6
F me was never good in physics , but what ya think the heat sink should then throw better heat outside from it
Im Better at Everything
Only till a certain extent the heatsink would do its job, after that, the temp's hit the sky.
Dekho the problem isn't with the heatstink. The problem is getting the heat to the heatsink!
Challo acha hai, galti accept karna to seekhe.At least AMD ki tarha lame excuses to nahin de rahe, e.g. transistors kam the blah blah.
Intel have geniuses in their R&D Department.. Ask them to come up with a solution to this.
They don't need to, it operates within their reliability and quality standards. Besides Haswell is expected in March 2013 and would have more performance but higher TDP. Haswell will be also be using the 22nm architecture but on a new platform (1150 socket).
Tell us something we don't know about it
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